BEHLKE POWER ELECTRONICS GmbH

FAST HIGH VOLTAGE SOLID-STATE SWITCHES

E	Fast Recovery High Voltage Diode Assemblies▶

● Free wheeling diodes for HTS solid-state switches in combination with inductive load ● Soft recovery characteristics ● High peak current capability ● Short recovery time

Model [sorted by housing dimensions]	Description / Comment ● Preferred stock type ○ Limited stock X Not recommended for new development		Dimensions [mm³]	Voltage [kV]	Pk. Current [A]



FDA 60-180	●	Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI	78 x 76 x 25	6	1800
FDA 60-240	●	Especially for HTS 61-40, HTS 61-240-SI and 61-160-FI	102 x 76 x 25	6	2400

FDA 100-75	●		84 x 35 x 30	10	750
FDA 100-150	●		84 x 35 x 30	10	1500
FDA 160-75	●		84 x 35 x 30	16	750
FDA 160-150	●		84 x 35 x 30	16	1500

FDA 200-75	●		101 x 35 x 30	20	750
FDA 200-150	●		101 x 35 x 30	20	1500

FDA 240-75	●		116 x 35 x 30	24	750
FDA 240-150	●		116 x 35 x 30	24	1500

FDA 300-75	●		141 x 35 x 30	30	750
FDA 300-150	●		141 x 35 x 30	30	1500

FDA 320-75	●		152 x 35 x 30	32	750
FDA 320-150	●		152 x 35 x 30	32	1500

FDA 640-75	●		300 x 35 x 35	64	750
FDA 640-150	●		300 x 53 x 53	64	1500

FDA 800-75	●		400 x 35 x 35	80	750
FDA 800-150	●		400 x 53 x 53	80	1500

FDA 100-300	●		84 x 70 x 35	16	3000

FDA 160-300	●		103 x 70 x 35	16	3000

FDA 200-300	●		103 x 70 x 35	20	3000

FDA 240-300	●		116 x 70 x 35	24	3000

FDA 320-300	●		152 x 70 x 35	32	3000

FDA 640-300	●		300 x 70 x 35	64	3000

FDA 800-300	●		370 x 70 x 35	80	3000

Option(1)	Description

PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. Not recommended in extremely fast circuits.
UL94	Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. P_d(max) will be increased by approx. 20-30%. (2)
CF	Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil).
CF-1	Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil).
CF-X2	Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling.
CF-X3	Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged by factor 3. Not relevant in connection with liquid cooling and forced air convection.
CF-CS	Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2)
CF-LC	Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm.
GCF	Grounded Cooling Flange: Cooling by a grounded base plate made of nickel plated copper. For high power applications. Increased coupling capacitance. Isolation voltage up to 40 kVDC.
GCF-X2	Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)
GCF-W	Water Cooler for Grounded Cooling Flange: Flat water cooling plate attached to the grounded cooling flange GCF. With water inlet and outlet.
DLC	Direct Liquid Cooling: Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Galden® and non-conductive liquids only. (2)
HI-REL	High Reliability / MIL Versions: Available on request. (2)

(1) New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. (2) Please consult factory for detailed information.

Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice. BEHLKE POWER ELECTRONICS GmbH June 2009