BEHLKE POWER ELECTRONICS GmbH

FAST HIGH VOLTAGE SOLID-STATE SWITCHES

D	Laboratory Pulser & OEM Pulser Units▶

● Ready for use ● No external components required ● All pulsers optimized for system integration
● Laboratory instruments with CE marking

Laboratory Pulser

Model [sorted by housing dimensions]	Description / Comment ● Preferred stock type ○ Limited stock X Not recommended for new development		Dimensions [mm³]	Voltage [kV]	Pk. Current [A]	HV Pulse Width [ns]

GHTS-Series:		Very compact push-pull switching units for general purpose. Polarity reversal by grounding plug .

GHTS 60	●		170 x 110 x 45	2 x 6	2 x 15	100…∞
GHTS 30	●		170 x 110 x 45	2 x 3	2 x 30	100…∞
GHTS 30 A	●		170 x 110 x 45	2 x 3	2 x 60	100…∞

GHTS 100	●		210 x 110 x 45	2 x 10	2 x 15	100…∞
GHTS 60 A	●		210 x 110 x 45	2 x 6	2 x 30	100…∞
GHTS 100 A	●		210 x 110 x 45	2 x 10	2 x 30	100…∞
GHTS 60 B	●		210 x 110 x 45	2 x 6	2 x 60	100…∞

FHPP-Series:		Precision push-pull pulsers with remotely controllable polarity reversal. Fast settling time, low ringing and low ripple. Ideal for mass spectrometry etc. Two outputs with high and low impedance (200 / 50 W)
FHPP 60	●		184 x 105 x 92	2 x 6	2 x 80	60…∞
FHPP 80	●		184 x 105 x 92	2 x 8	2 x 60	60…∞
FHPP 100	●		184 x 105 x 92	2 x 10	2 x 50	60…∞
FHPP 120		On request	184 x 105 x 92	2 x 12	2 x 30	60…∞

Option(1)	Description

Option 01	Protective Series Resistor 200 Ohm. Only for model series GHTS.
Option 02	Built-in Miniature Fan. Only for model series GHTS.
Option GCF	Grounded Cooling Flange: Cooling by a grounded base plate made of nickel plated copper. Only for model series FHPP.

OEM Pulser Units

Model [sorted by housing dimensions]	Description / Comment ● Preferred stock type ○ Limited stock X Not recommended for new development		Dimensions [mm³]	Voltage [kV]	Pk. Current [A]	HV Pulse Width

FQD-Series:		Fast Solid-State On-Q-Switch Driver. Very compact design for placement directly at the pockels cell. Available with cooling options CF, GCF, GCF-W and DLC for high frequency / high power dissipation.				Depends on R x C
FQD 40-03	●	Based on HTS 40-03, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	4	35	100 ns…1 ms
FQD 40-06	●	Based on HTS 40-06, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	4	60	100 ns…1 ms
FQD 50-02	●	Based on HTS 50-02, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	5	25	100 ns…1 ms
FQD 50-05	●	Based on HTS 50-05, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	5	50	100 ns…1 ms
FQD 60-02	●	Based on HTS 60-02, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	6	20	100 ns…1 ms
FQD 60-04	●	Based on HTS 60-04, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	6	40	100 ns…1 ms
FQD 80-01	●	Based on HTS 80-01, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	8	15	100 ns…1 ms
FQD 80-03	●	Based on HTS 80-03, with 200 mm long pigtails for direct pockels cell connection	79.5 x 38 x 19	8	30	100 ns…1 ms
FQD 30-08-UF	●	Based on HTS 30-08-UF, with 200 mm long pigtails for direct pockels cell connection, ultra fast	79.5 x 38 x 19	3	80	100 ns…1 ms
FQD 30-06-UF	●	Based on HTS 30-06-UF, with 200 mm long pigtails for direct pockels cell connection, ultra fast	79.5 x 38 x 19	3.6	60	100 ns…1 ms

DSM-Series:		Universal pockels cell pulser with ~3 ns transition time and variable pulse width from 10 ns–100 μs. Very compact design for placement directly at the pockels cell. Available with cooling options CF, GCF, GCF-W and DLC for high frequency / high power dissipation.
DSM 31-12	-	On request		3		10 ns–100 μs
DSM 61-12	-	On request		6		10 ns–100 μs
DSM 91-12	-	On request		9		10 ns–100 μs

Option(1)	Description

HFB	High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFS	High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LP	Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)
I-PC	Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers). (2)
SPT-C	Shielded Pigtail for Control Connection: Cable (l=300mm, Z=100Ω) with LEMO plug+socket and 100Ω termination. Improved noise immunity in case of long distance to driver circuits. (3)(4)
PT-C	Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF.
PIN-C	Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HV	Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
UL94	Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FC	Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC.
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. P_d(max) will be increased by approx. 20-30%. (2)
CF	Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil).
CF-1	Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil).
CF-X2	Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling.
CF-X3	Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged by factor 3. Not relevant in connection with liquid cooling and forced air convection.
CF-CS	Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2)
CF-LC	Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm.
CF-DR	Cooling Fin for Driver: Small extra cooling fin for the control electronics. On ground potential. Can be necessary in combination with HFS. (2)
GCF	Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance C_C. In combination with option SPT-C only.
GCF-X2	Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)
GCF-W	Water Cooler for Grounded Cooling Flange: Flat water cooling plate attached to the grounded cooling flange GCF. With water inlet and outlet.
DLC	Direct Liquid Cooling: Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Galden® and non-conductive liquids only. (2)
HI-REL	High Reliability / MIL Versions: Available on request. (2)

(1) New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. (2) Please consult factory for detailed information. (3) These options are EMC-relevant and are recommended for industrial power applications, difficult noise ambients, prototype experiments with flying leads and for users without special EMC design experience. (4) This option is not available in connection with Sync. I/O for parallel connection. Please consult factory for detailed information.

Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice. BEHLKE POWER ELECTRONICS GmbH June 2009