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FAST HIGH VOLTAGE SOLID-STATE SWITCHES |
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C3 |
Variable On-Time, Low Coupling Capacitance, MOSFET▶ |
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● Versatile switching elements with true relay character ● On-time controllable by TTL signal ● Simplified EMC and reduced capacitive losses due to low coupling capacitance |
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Model [sorted by |
Description / Comment |
Dimensions |
Voltage |
Pk. Current |
On-Resist. |
On-Time |
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HTS 31-12-LC |
● |
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89 x 64 x 27 |
3 |
120 |
1.25 |
60…∞ |
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HTS 61-06-LC |
● |
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89 x 64 x 27 |
6 |
60 |
5 |
60…∞ |
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HTS 111-03-LC |
● |
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89 x 64 x 27 |
11 |
30 |
24 |
60…∞ |
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HTS 121-03-LC |
○ |
|
89 x 64 x 27 |
12 |
30 |
24 |
60…∞ |
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--------------- |
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HTS 41-12-LC |
● |
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112 x 64 x 27 |
4.5 |
120 |
2.5 |
60…∞ |
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HTS 91-06-LC |
● |
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112 x 64 x 27 |
9 |
60 |
10 |
60…∞ |
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HTS 161-03-LC |
● |
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112 x 64 x 27 |
16 |
30 |
36 |
60…∞ |
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HTS 181-03-LC |
○ |
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112 x 64 x 27 |
18 |
30 |
36 |
60…∞ |
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--------------- |
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HTS 81-12-LC |
○ |
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200 x 70 x 27 |
8 |
120 |
3.75 |
100…∞ |
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HTS 91-12-LC |
● |
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200 x 70 x 27 |
9 |
120 |
3.75 |
100…∞ |
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HTS 161-06-LC |
○ |
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200 x 70 x 27 |
16 |
60 |
15 |
100…∞ |
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HTS 181-06-LC |
● |
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200 x 70 x 27 |
18 |
60 |
15 |
100…∞ |
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● |
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200 x 70 x 35 |
33 |
30 |
72 |
100…∞ |
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HTS 361-03-LC |
○ |
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200 x 70 x 35 |
36 |
30 |
72 |
100…∞ |
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--------------- |
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HTS 161-12-LC |
○ |
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263 x 70 x 35 |
16 |
120 |
7.5 |
150…∞ |
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HTS 181-12-LC |
● |
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263 x 70 x 35 |
18 |
120 |
7.5 |
150…∞ |
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HTS 331-06-LC |
○ |
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263 x 70 x 35 |
33 |
60 |
30 |
150…∞ |
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HTS 361-06-LC |
● |
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263 x 70 x 35 |
36 |
60 |
30 |
150…∞ |
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--------------- |
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● |
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260 x 70 x 35 |
50 |
30 |
86 |
150…∞ |
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--------------- |
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X |
Use HTS 701-10-LC2 for new development |
300 x 70 x 35 |
65 |
30 |
144 |
150…∞ |
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HTS 721-03-LC |
X |
Use HTS 701-10-LC2 for new development |
300 x 70 x 35 |
72 |
30 |
144 |
150…∞ |
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--------------- |
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HTS 101-20-LC2 |
● |
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103 x 70 x 35 |
10 |
200 |
1.95 |
120…∞ |
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HTS 201-10-LC2 |
● |
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103 x 70 x 35 |
20 |
100 |
7.8 |
120…∞ |
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--------------- |
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● |
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252 x 150 x 68 |
50 |
100 |
18 |
250…∞ |
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HTS 501-20-LC2 |
● |
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252 x 200 x 68 |
50 |
200 |
9 |
250…∞ |
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--------------- |
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● |
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312 x 150 x 68 |
70 |
100 |
25 |
250…∞ |
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HTS 701-20-LC2 |
● |
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312 x 200 x 68 |
70 |
200 |
12.5 |
250…∞ |
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--------------- |
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● |
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372 x 150 x 68 |
90 |
100 |
32 |
250…∞ |
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HTS 901-20-LC2 |
● |
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372 x 200 x 68 |
90 |
200 |
16 |
250…∞ |
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--------------- |
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HTS 1001-10-LC2 |
● |
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432 x 150 x 68 |
100 |
100 |
36 |
250…∞ |
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HTS 1001-20-LC2 |
● |
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432 x 200 x 68 |
100 |
200 |
18 |
250…∞ |
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--------------- |
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HTS 1201-10-LC2 |
● |
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492 x 150 x 68 |
120 |
100 |
42 |
250…∞ |
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HTS 1201-20-LC2 |
● |
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492 x 200 x 68 |
120 |
200 |
21 |
250…∞ |
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--------------- |
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HTS 1401-10-LC2 |
● |
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672 x 150 x 68 |
140 |
100 |
52 |
250…∞ |
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HTS 1401-20-LC2 |
● |
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672 x 200 x 68 |
140 |
200 |
26 |
250…∞ |
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Option(1) |
Description |
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HFB |
High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated. |
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HFS |
High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2) |
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LP |
Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3) |
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MIN-ON |
Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits. |
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MIN-OFF |
Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits. |
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LNC |
Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
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LL |
Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
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LN |
Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with extremely sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2) |
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ISO-25 |
25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
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ISO-40 |
40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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ISO-80 |
80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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ISO-120 |
120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers). (2) |
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I-FWD |
Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
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I-FWDN |
Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
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SPT-C |
Shielded Pigtail for Control Connection: Cable (l=300mm, Z=100Ω) with LEMO plug+socket and 100Ω termination. Improved noise immunity in case of long distance to driver circuits. (3)(4) |
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PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF. |
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PT-HV |
Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits. |
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ST-HV |
Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
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UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
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TH |
Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
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FC |
Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC. |
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ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
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CF |
Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil). |
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CF-1 |
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil). |
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CF-X2 |
Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling. |
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CF-CS |
Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) |
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CF-LC |
Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm. |
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CF-DR |
Cooling Fin for Driver: Small extra cooling fin for the control electronics. On ground potential. Can be necessary in combination with HFS. (2) |
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GCF |
Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance CC. In combination with option SPT-C only. |
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DLC |
Direct Liquid Cooling: Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Galden® and non-conductive liquids only. (2) |
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HI-REL |
High Reliability / MIL Versions: Available on request. (2) |
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(1) New option code: Data
sheets may differ from this coding system (especially older ones) and
do not indicate all possible options as per above table. (2) Please
consult factory for detailed information. |
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Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice. BEHLKE POWER ELECTRONICS GmbH July 2010 |
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