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FAST HIGH VOLTAGE SOLID-STATE SWITCHES |
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B3 |
Fixed On-Time, High di/dt, Ultra Fast, MOSFET▶ |
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● Extremely fast turn-on rise time ● True gate control (no avalanche technique) for highest reliability over a wide range of operating temperatures and load conditions ● Very low impedance ● Very EMC tolerant ● Available with on-time options from 5 ns to 1 μs ● Designed for attachment on printed circuit boards (PCB) |
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Model [sorted by |
Description / Comment |
Dimensions |
Voltage |
Pk. Current |
On-Resist. |
On-Time |
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● |
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80 x 38 x 25 |
3.6 |
60 |
3.6 |
120 |
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80 x 38 x 25 |
3 |
80 |
2.5 |
120 |
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--------------- |
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● |
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89 x 64 x 31 |
5 |
80 |
4 |
200 |
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Option OT-5n not available |
89 x 64 x 31 |
5 |
120 |
3 |
200 |
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--------------- |
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● |
Option OT-5n not available |
122 x 64 x 31 |
8 |
120 |
4.5 |
200 |
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● |
Option OT-5n and OT-10n not available |
122 x 89 x 31 |
8 |
200 |
2.7 |
200 |
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HTS 100-20-UF |
● |
Option OT-5n and OT-10n not available |
153 x 102 x 25 |
10 |
200 |
3.4 |
200 |
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HTS 120-15-UF |
● |
Option OT-5n and OT-10n not available |
153 x 102 x 25 |
12 |
150 |
4.8 |
200 |
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Option(1) |
Description |
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HFB |
High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated. |
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HFS |
High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2) |
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LP |
Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3) |
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OT-5n |
On-Time Reduction: On-Time reduced to 5 ns |
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OT-10n |
On-Time Reduction: On-Time reduced to 10 ns |
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OT-20n |
On-Time Reduction: On-Time reduced to 20 ns |
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OT-P |
Programmable On-Time: On-Time adjustable in certain limits by means of external programming resistors. (2) |
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OT-C |
Customized On-Time: On-Time according to customer’s specifications. Any value between 20 ns and 1 μs. (2) |
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MIN-PS |
Minimum Pulse Spacing: Individually increased Recovery Time to ensure a minimum HV pulse spacing indepently of control pulse spacing. For safety relevant circuits. |
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ST |
Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo). |
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LNC |
Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
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LL |
Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
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ISO-25 |
25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
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ISO-40 |
40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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ISO-80 |
80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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ISO-120 |
120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
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I-PC |
Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers). (2) |
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I-FWD |
Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
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I-FWDN |
Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
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SPT-C |
Shielded Pigtail for Control Connection: Cable (l=300mm, Z=100Ω) with LEMO plug+socket and 100Ω termination. Improved noise immunity in case of long distance to driver circuits. (3)(4) |
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PT-C |
Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF. |
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PIN-C |
Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard. |
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PT-HV |
Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits. |
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ST-HV |
Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
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UL94 |
Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
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FC |
Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF, GCF and DLC. |
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ITC |
Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
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CF |
Non-Isolated Cooling Fins: Standard sizes in categories I to VII according to model. Nickel plated copper 0.5 mm, fin height 35 mm. For air and liquid cooling (e.g. Galden® or oil). |
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CF-1 |
Non-Isolated Cooling Fins d=1mm: Nickel plated copper 1.0 mm instead of 0.5 mm. The Max. Power Dissipation will be increased by ~80 %. For air and liquid cooling (e.g. Galden® or oil). |
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CF-X2 |
Non-Isolated Cooling Fins enlarged by x2: Fin area enlarged by factor 2. Not relevant in connection with liquid cooling. |
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CF-X3 |
Non-Isolated Cooling Fins enlarged by x3: Fin area enlarged by factor 3. Not relevant in connection with liquid cooling and forced air convection. |
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CF-CS |
Non-Isolated Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) |
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CF-LC |
Non-isolated Cooling Fins optimized for liquid cooling: Double fins, nickel plated copper, 0.5 mm thickness, height 20 mm. |
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CF-DR |
Cooling Fin for Driver: Small extra cooling fin for the control electronics. On ground potential. Can be necessary in combination with HFS. (2) |
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GCF |
Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance CC. In combination with option SPT-C only. |
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GCF-X2 |
Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2) |
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GCF-W |
Water Cooler for Grounded Cooling Flange: Flat water cooling plate attached to the grounded cooling flange GCF. With water inlet and outlet. |
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DLC |
Direct Liquid Cooling: Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Galden® and non-conductive liquids only. (2) |
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HI-REL |
High Reliability / MIL Versions: Available on request. (2) |
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(1) New option code: Data
sheets may differ from this coding system (especially older ones) and
do not indicate all possible options as per above table. (2) Please
consult factory for detailed information. |
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Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice. BEHLKE POWER ELECTRONICS GmbH June 2009 |
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